概述

Introducing the Bondjet BJ820: High-Speed Fully Automatic Fine Wire Wedge Bonder. It excels in wire bonding for diverse applications like RF devices, COB, MCM, automotive, etc., with aluminum, gold, or ribbon wire. Unmatched speed, precision, and flexibility make it an industry benchmark. Real-time bond quality monitoring, intelligent automation, and optimized tool change further enhance its capabilities. Up to 7 wires/sec, 1 μm at 3 σ axis repeatability, and a large 305mm x 410mm bonding area. Offers loop length adjustment from 70 µm up to 20 mm.