8090
概述
The Model 8090, a large area wedge bonder designed to process the large panels and carriers used in chip-on-board (COB), multi-chip modules (MCMs) and similar devices.
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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
