概述

Small Wire Bonder/Small Wire Conversion kit. Bonds to almost any electronic package requiring 38-75 micron (1.5-3 mil) wire. Four-axis head allows bonding in any direction, to any type of module, leadframe or hybrid substrate. Programmable bonding parameters for each bond produce better bond quality and reliability. Available as a stand-alone machine, as part of a large and small dual head bonder, or as a retrofit to an existing 360C large wire bonder. Unique low maintenance bond head provides soft touchdown combined with high resolution LVDT for controlled bond placement. Motorized dereeler assembly and jewel bearing wire feed mean better looping control, low maintenance, and high uptime. Programmable lift-off angle and wire feed minimize heel cracks. Modular and flexible design makes for easy integration into automated lines and easy changeover between small and large wire.