说明
无说明配置
无配置OEM 型号描述
The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator文件
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PREFERRED
SELLER
类别
Wire / Wedge / Ball Bonder
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
66212
晶圆尺寸：
8"/200mm
年份：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PREFERRED
SELLER
SHINKAWA
UTC 1000 SUPER
类别
Wire / Wedge / Ball Bonder
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
66212
晶圆尺寸：
8"/200mm
年份：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator文件
无文件