概述

High-speed automated X-ray CT inspection system The X750 is used for non-destructive inspection of 5G infrastructure/modules and in-vehicle electrical components as a high-definition, high-quality inspection using full 3D-CT. In recent years, the VT-X750 has been used for inspection of solder voids and solder filling of through-hole connectors in final assembly of power devices such as IGBTs and MOSFETs, which are essential for EVs, as well as Integrated machine and electric power. It has also been widely utilized in the fields of aerospace, industrial equipment, and semiconductors.