说明
ALD (Atomic Layer Deposition)配置
无配置OEM 型号描述
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.文件
无文件
ASM
EAGLE XP
已验证
类别
ALD
上次验证： 22 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
23230
晶圆尺寸：
12"/300mm
年份：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
EAGLE XP
类别
ALD
上次验证： 22 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
23230
晶圆尺寸：
12"/300mm
年份：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
ALD (Atomic Layer Deposition)配置
无配置OEM 型号描述
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.文件
无文件