DISCO develops, manufactures, and sells precision machines and precision processing tools.

The DFL7360FH is a laser saw from Disco Corporation. It is a dedicated tape frame transfer model that realizes high productivity for sapphire and MEMS processing and supports a variety of processes1. It uses Stealth Dicing, a processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander2. This method controls cutting waste because only a subsurface layer is processed, making it suitable for workpieces that are vulnerable to contamination. It is also a dry process that does not require cleaning, suitable for applications (such as MEMS) that are vulnerable to mechanical load.

DISCO

DFL7360FH

2016
Developed DFD6310, a panel level packaging compatible dicing saw.

DFD6310

The Disco-DFL7361 is a laser saw developed by Disco Corporation. It uses a processing method called Stealth Dicing, which focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. This method controls cutting waste because only a subsurface layer is processed, making it suitable for workpieces that are vulnerable to contamination.

DFL7361

The DAC351 is a compact, automatic dicing/cutting saw manufactured by DISCO Corporation. It is designed for precision cutting work on materials such as magnetic heads for VCRs and computer disk drives, using 2-inch or 3-inch blades. The machine features a closed loop control system on the Y-axis and a cross roller bearing and ball screw movement on the Z-axis, which assures high precision and rigidity. The maximum workpiece handling size is 153 x 153 mm, and the maximum blade size is 76.2 mm. The machine is only 500 mm wide and is equipped with a 1.5 kW Synchro SpindleTM (air bearing spindle). It is ideal for applications that require precision cutting of magnetic heads for VCRs and computer disk drives.

DAC351

DAD-2H/8

DFL7260

DTU1530

EAD 6750S

DAD-3D/8

DGP8761HC

DTU160

DAC550

DFG8390

Achieves high productivity for sapphire, lithium tantalate, and MEMS processing
Φ200 mm        Stealth Dicing™         SDBG         SDTT

DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones.
Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.
This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.

DFL7341

DAC350

DFM-M150

DFG8360

1975
Automatic Scriber/Dicing Saw DAD-2H developed and acclaimed a hit when exhibited at SEMICON West.

Discontinued 	Jan. 1978

DAD-2H

DAC-2SP/86

2017
Developed DFL7362, a stealth dicing laser saw that achieves higher throughput.

Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si
Φ300 mm        Stealth Dicing™       SDBG       SDTT

DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers.
Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength.
The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.

DFL7362

The DAD3220 is an automatic dicing saw designed for compactness and compatible with 6 × 6-inch workpieces using a user-specified specification. It has a Φ150 mm single spindle and features an LCD touch panel with a graphical user interface for easy and intuitive operation.

DAD3220

The DFM2800 is a fully automatic multifunction wafer mounter made by DISCO Corporation1. It is a specialized wafer mounter for inclusion in an inline system with a backgrinder to process Φ300 mm ultra-thin wafers. It mounts wafers that have been thinned with the DGP8761 system onto dicing tape or tape frames and removes the front side protection tape in a stable process.

DFM2800

DAC-2SPH

Fully automatic dicing saw with parallel dual spindles
Φ200 mm
Parallel dual spindle
Package Singulation

DFD6450

Fully automatic dicing saw with dual chuck tables
DFD6760 is a high end model which has further enhanced productivity from the existing model, DFD6362. Since this dicing saw has two chuck tables (hereafter called C/T), it is possible for transfer and alignment to occur on one chuck table, while processing is performed on the other chuck table. This shortens the spindle waiting time for processing considerably and improves productivity. In addition, inspection and measurement operations including processed workpiece image recording and workpiece thickness measurement using an NSD* can be performed on one chuck table, while processing proceeds on the other chuck table to maintain throughput. Increased X, Y and Z-axis feed speeds (same as the existing model) also contribute to the reduced processing time.

* Non-contact Surface Detector （option）

DFD6760

DAC-2SP/6

DAC-4SP/126

DFD-2HSTI

DFD690

DFG871

Amplifier of blade breakage detector, Amplifier of non-contact setup sensor

DFD6360A

DAD685

Spin cleaning and drying for workpieces processed using dicing saws

Manual cleaning system with enhanced cleaning performance
The DCS1441 is the optimal solution for cleaning and drying workpieces processed using a semi-automatic dicing saw or other equipment. High-pressure cleaning with a maximum discharge pressure of 11.8 Mpa and user-created cleaning sequences (settings for the cleaning arm swing speed and spinner rotation speed) offer the optimal cleaning operation for a wide range of workpieces. In addition, the rinse cleaning, atomizing cleaning nozzle, and high performance atomizing nozzle specifications can be installed as an option. The DCS1441 can greatly reduce the number of processing particles on a wafer

DCS1441

DFD680

1980
New rotary surface grinder DFG-83H/6, developed.

DFG-83H/6

DFD 6320

DAC-4SPI/126

DAC770

2018
Developed DFG8640, a fully automatic grinder compatible with Φ8-inch wafers, which achieves high-precision processing of difficult-to-grind materials.

DFG8640

Supports small volume grinding with high precision
Φ200 mm
1 axis, 2 chuck tables

DFG8340

DAD-2H/6TM

Manual cleaning system for Φ300 mm wafers with enhanced cleaning performance

The DCS1460 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the cleaning arm sweep speed and cleaning locations are configurable options) for effective and efficient cleaning. In addition to the standard specification high pressure cleaning nozzle an atomizing cleaning nozzle can be selected. These two different types of cleaning nozzles can be mounted to produce a double cleaning arm configuration, making it possible to clean a wide range of workpieces with a single unit.

DCS1460

Die separator for small-die wafers
Φ300 mm
SDBG
SDTT


DDS2310

The EAD695 is a jig-mounted dicing engine from DISCO that, when combined with an OEM customer’s handler, produces a CSP Singulation System. The engine is equipped with special CSP software containing various alignment methods. It offers advanced precision technology, excellent process performance, and a superior cutting finish. The system also boasts automatic alignment and workpiece handling, ease of operation and maintenance, and minimized cost of ownership. Its superior design and construction, as well as the use of quality components, ensure reliability.

EAD695

DTG8460

Fully Automatic
Φ200 mm
Facing dual spindle

DFD6342

DCS-6

Developed 2019
Die separator: Equipment used to singulate die from workpieces attached to dicing tape. First, die attach film, which is used to mount and laminate thin die, or a wafer with an internal SD layer formed after laser stealth dicing is attached to the tape. Then, the die are singulated by expanding the tape.

DDS2320

2000
New series dicing saws, DFD6350 and DFD6360, and new series grinder, DFG8540, developed.

DFD6350

DFG-81IF/8

BSG-1

DAD-3S/8

DPM2190CX

DFL7348

DAG110

1987
Fully Automatic Surface Grinder DFG-82IF/8 developed.

DFG-82IF/8

Reliable separation of small die wafers
The DDS2010 offers an integrated expansion and breaking solution to achieve high-yield and high-throughput die singulation of wafers processed using Stealth Dicing™ process (SD)※.

*Stealth Dicing™ is a processing method that focuses a laser within the workpiece to form a modified layer, after which a tape expander is used to separate the die. This processing method is effective in achieving street reduction for small die or rectangular-shaped die such as RFID ICs and line sensors.

DDS2010

2017
Developed DFD6562, a small-footprint, fully automatic dicing saw that supports Φ300 mm wafers.

DFD6562

The DAS8930 is a semi-automatic surface planer for Φ300 mm wafers, with 1 axis and 1 chuck table, manufactured by Disco Corporation1. It uses ultrahigh-precision planarization technology with a diamond bit to provide solutions for high-precision planarization of ductile materials such as metals, resins, and their composites, as well as solutions for reducing bump height variation and surface roughness.

DAS8930

DFM-M200

DCS1410

2011
Developed the DFG8830, a grinder with a 4-axis and 5-chuck table configuration for hard and brittle materials such as sapphire and SiC.

DFG8830

The DFD6363 is a flagship model for Φ300 mm wafers with high process extensibility. It is compatible with both frame and two-way (frame/wafer) transferring and supports various processes, including full cut and half cut, with only one DFD6363. This reduces size conversion operations and human error. It also supports both standard cassettes (Φ200 mm / Φ300 mm) and FOUP cassettes.

DFD6363

Stable High Precision Processing
DTU1550 is a water supply unit for dicing saws and grinders that provide a stable supply of spindle cooling water or dicing water at a constant temperature and suitable pressure. Due to optimizations in the unit design, changes in temperature when changing the flow rate of dicing water can be kept under 1ºC. Changes in dicing saws, grinder spindles, chuck tables, and workpiece areas around the process point due to changes in temperature can be minimized to help improve processing precision.

DTU1550

Highly expandability to support various processing needs
Φ300 mm        Single spindle

Supports a wide range of applications
DAD3361 is a semi-automatic dicing saw capable of handling Φ300 mm workpieces.* A high-output 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque, high-rigidity spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic. Support for blades of up to Φ5 inches is possible with user-specified specifications. In addition, the alignment function for multiple-mounting workpieces to one table frame can be added an option.

* Supports jig tables with Φ395 mm or smaller circumscribed circles (user-specified specification).

DAD3361

DAC750

The Disco DFD6561 Fully Automatic Dicing Saw is a space-saving solution for Φ300 mm dicing. It is equipped with uniquely developed short spindles and an optimized bridge-type frame structure resulting in a 16% reduced footprint. All maintenance can be performed from the front of the equipment, thus reducing the area needed for installation and maintenance areas by 20% (compared to the DFD6362).

DFD6561

DAD-2H/5LI

DAD-2H/6M

DVC010

1978
World's first fully automatic dicing saw DFD-2H/S, developed.

DFD-2H/S

DAD690

DFG830

DAC552

DFD6860

EAD 6340K

DAD680

CMP polisher designed to process hard-to-process materials such as sapphire and SiC
Φ200 mm                1 axis, 2 chuck tables                 Wafer Thinning               Stress Releaf

Fully automatic operation
The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically.

For small workpieces made of difficult-to-process materials
The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.

DFP8141

2001
Dry polishing process developed; world's first dry polisher, DFDP8140, and dry polishing wheels released.

DFDP8140

DAD6450

Discontinued 	Nov. 1996
up to 12 in wafer

DAD380

DFD-3S/8

DFP8160

DAD-2H/5

Φ6-inch ingot support laser saw for KABRA process

DAL7420

DAD520

The DAS8920 is a semi-automatic surface planer for Φ8-inch wafers (Φ200 mm) with 1 axis and 1 chuck table. It uses ultrahigh-precision planarization technology with a diamond bit to provide solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.

DAS8920

DAC-2SP/65

2007
Developed the "DFL7340/7360" laser saws based on a business alliance with Hamamatsu Photonics

DFL7360

a laser saw which supports the KABRA processing of Φ8-inch wafers

DAL7440

Disco’s laser application lineup supports miniaturized next generation devices. Providing the optimum ”Kiru” technology for various materials. Disco DAL7020 is an automatic equipment for ablation and is the smallest model for sapphire processing with workpiece size 150mm.

DAL7020

DFX2400

DFD-2HST

The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.

DAD3350

The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.

DAD321

DFD651

The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.

DFL7160

The Disco DFD6361 is a Fully Automatic Dicing Saw. It offers highly consistent and dependable cut quality through the new Synchro Spindle featuring superior radial rigidity. The DFD6361 enhances throughput in two distinct ways: DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup.

DFD6361

The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.

DFD641

The Disco DFD6340 is a Fully Automatic Dicing Saw that features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30% for step/bevel cut and 40% for dual cut when compared with parallel dual spindle dicing saws. It has the smallest footprint of any 8" saw in its class and utilizes an adjustable LCD touch screen graphical user interface making operation and maintenance intuitive and easy.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

DISCO

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