Designed, developed & manufactured high performance and precision chemical processing equipment. Products included electrochemical deposition systems for electroplating copper, gold, solder and other metals; surface preparation systems for cleaning, stripping and etching silicon wafers; and wafer transport container cleaning systems.

The LT210c is an advanced electrochemical deposition tool that delivers high throughput in a small footprint. It uses patented Capsule™ technology for superior copper fill and integrated removal of backside and bevel copper contamination. The tool is fully automated and can fill features as small as 0.08µm with superior purity and uniformity. It has a small footprint and offers fast installation, low cost of ownership, and high reliability. The LT210c can be used for a variety of applications including Copper Damascene, Nickel ECD, Solder ECD, Gold ECD, Platinum ECD, Copper Anneal, Tantalum Anodization (High-K), Patterned Copper, Gold ElectroEtch, ECD Seed Layer, and Thin Film Heads.

SEMITOOL

LT-210c

The LT-210 is a single substrate processor that provides a fully automated platform for high throughput production of Cu Interconnect devices. It utilizes Semitool’s advanced electrochemical deposition technology to achieve this. The LT-210 is capable of electrochemical deposition (ECD) of materials such as Copper, Gold, and Solder for Cu Dual Damascene processes. This makes it an ideal tool for the production of high-quality interconnect devices.

LT-210

SRD-870ST

STORM 300

SRD-240S

The Spray Solvent Tool (SST) is a compact, efficient system that enhances chemical reactions on wafer surfaces. It employs mechanical and centrifugal forces to achieve uniform coverage on both sides of the wafer. The closed loop process control ensures consistent results, while continuous recycling and filtration of chemicals reduce waste. The SST offers precise temperature control and flexibility in chemical delivery methods. With its high throughput, small footprint, and operator safety features, it provides reliable and low-maintenance operation. The tool supports various processes, including GaAs clean, metal lift-off, photoresist removal, post-etch residue removal, and thin film heads. It utilizes technologies such as copper RDL and pillar structures. Flexibility - featuring two, four, or seven tank configuration in small footprint cabinet; process chambers, product carriers, and quick-disconnect rotors are available for wafers up to 200mm

SST 772

SRD-270ST

SRD-480F

The APx system is a single-wafer processor based on our linear automation technology. The tool is designed primarily for the wafer-level packaging market, where lower acquisition cost and flexibility are important. The architecture of the system allows the adaptation of electrochemical deposition and surface preparation chambers for automated or manual operation.

SRD-440S

SPECTRUM

SST 641

P328

SRD-840ST

SD250

SRD-470ST

SRD-4300ST

SRD-8300F

ST 260D

SRD-2300ST

The Spectrum is an advanced automated batch processing system for cleaning, stripping and etching applications. Its compact modular design features high throughput, flexible process formats and precise control for low cost of ownership. In addition to our proprietary spray processing modules, the Spectrum can be equipped with immersion and surface tension gradient dry capabilities. It can be configured to use either corrosives, solvents or our proprietary hydrozone (Spectrum HO) based processes for polymer removal, photoresist strip and critical cleaning applications. The Spectrum is available to accommodate both 200mm and 300mm wafer sizes.

SPECTRUM HO

Millennium is a high-volume surface preparation system that incorporates spray, vapor, immersion, and rapid thermal anneal (RTA) technologies. It features high productive performance with six to ten processing chambers and one or two robots. The system utilizes Semitool’s Capsule™ technology for chemical delivery and surface tension gradient dry for advanced particle control. The chamber design can accommodate immersion, spray, vapor, or RTA processing. The system can increase productivity, reduce defect density, improve process control, reduce cycle time, and reduce cost of ownership. It has various applications including oxide etch, photoresist removal, post-CMP clean, pre-photo lithography clean, post-etch residue (polymer removal), back side metals clean, GaAs etch (gate recess etch), under bump metallurgy (UBM etch), pre-diffusion (pre-epi clean), pre-epi LTO oxide removal (bevels and face), pre-deposition (pre-gate clean), hydrOzone photoresist strip (post-ash), metal lift-off, Cu back side clean and bevel etch, back side films etch, fluorOzone clean, HF vapor etch.

MILLENNIUM

SRD-8300ST

SP012F1 SSC SII

WSST

SST 408

C221280PB

SRD-460S

SRD-240F

SRD-460F

SRD-8300-5-1-E-ML

SST 300

SPECTRUM 300

SP-W-200

PARAGON

SRD-260S

ST 260C

SRD-880ST

SRD-440ST

The Magnum 3000 designed for the new state-of-the-art 300mm wafer fabs currently planned by customers.


MAGNUM 3000

SRD-280ST

SRD-280F

SRD-860F

SP012F1-ASC	

SRD-270F

SRD-260F

SRD-2300F

SRD-480ST

ACMS XT II

ST 470

SRD-460ST

SRD-840S

SRD-270S-3-1-E-ML

This high performance tool cleans, rinses and dries product as large as 300mm round or 300mm square. With 25 wafers per chamber, this tool is available in single or double-bowl configurations. The SRD can be configured to benchtop, stand-alone or bulkhead fab requirements. This tool features Spray - On-axis orientation allows cold or hot (>50ºC) water to evenly spray the wafers. Clean/Rinse - Built-in resistivity monitoring assures an automatic and reliable clean: the process chamber is cleaned with the product: quick-ramp, brushless DC motor provides economy and efficiency. Centrifugal drying, coupled with heated, filtered nitrogen and a low-pressure nitrogen purge with blanket heaters Efficient Chamber Design. Easy to change rotors for simple reconfiguration to match any array of applications. A typical 25-wafer payload takes <7 minutes for a complete cycle (load, rinse, spin dry, unload) Ultra Clean - On-axis orientation keeps wafers parallel, allowing fresh DI water manifolds to spray both sides of the product uniformly Efficient - Up to ten user-defined recipes Low CoO - Smallest footprint with the highest throughput available with over 95% uptime Supports Spray Clean (SRD) Spin-Rinse-DrySpray Clean (SRD) Spin-Rinse-Dry

SRD-860S

The Advanced Chemical Management System, or ACMS, is an automated electroplating bath control unit. It maintains the desired chemical balance in the plating baths by automatically analyzing and replenishing the chemical constituents using our proprietary technology. Fully integrated with the Company's ECD systems, the primary applications are copper and solder deposition.

ACMS

Magnum® is a multimodule chemical processing platform that combines solvent, acid, and spin rinser/dryer capabilities into a single automated system. It is designed for high throughput production and has the flexibility for future expansion. The platform is capable of handling 150mm, 200mm, and 300mm wafers. Magnum® is used for wet cleaning and etching processes, including Pre-W-Silicide (HF Vapor), Pre-Salicide Clean, Metal etch, Pre-CVD clean, Pre-diffusion clean, Photoresist strip, Polymer removal, CMP clean, and Reclaim.

MAGNUM

SST 642

SST-C-621-280

Centurium is a fully automated chemical processing tool designed for flat panel displays. It is capable of performing wet cleaning and etching processes, which are essential steps in the manufacturing of flat panel displays. The tool is equipped with several features, including metal etch, photoresist strip, clean, rinse, and dry. These features allow for a complete and efficient processing of flat panel displays, ensuring high-quality results. With its advanced automation capabilities, Centurium is a reliable and effective solution for the chemical processing needs of flat panel display manufacturers.

CENTURIUM

SRD-880F

SST-C-742-280

EQ23

Semilab SDI CnCV 230 tool for non-contact C-V characterisation of wide bandgap semiconductors. In response to broadening interest from the wide bandgap community, our team at Semilab SDI, based in Tampa, FL, has introduced the CnCV 200 series of tools. Its capabilities include dopant concentration profiling of GaN and SiC, measuring the two-dimensional electron-gas sheet charge in an AlGaN/GaN HEMT, and characterisation of interfaces between dielectrics and wide bandgap semiconductors

CnCV 230 

SST 302

SRD-440F

SRD-4600L-5-2-E-VT

SRD-260ST

SRD-2300S

SST-421-280F

SRD-870S

The Spray Acid Tool (SAT) is a versatile tool that offers a range of cleaning, etching, and stripping capabilities. It features a multichamber design that allows for safe and economical operation in a completely closed environment. The SAT is 300mm ready, meaning it can handle wafers of that size. Some of the specific applications of the SAT include post-CMP clean, photo-resist strip, polymer removal, pre-diffusion clean, monitor wafer clean, and metal etch. These processes are essential for the preparation and maintenance of semiconductor wafers during the manufacturing process.

The Spray Solvent Tool (SST) is a world standard in chemical stripping, developing, and cleaning technology. It has a multichamber capability and is 300mm ready. The SST can be used for a variety of processes, including developing, photoresist stripping, polymer removal, pre-metal deposition cleaning, and metal lift-off. This tool provides a versatile and efficient solution for a wide range of applications in the semiconductor industry.

This high performance tool cleans, rinses and dries product as large as 300mm round or 300mm square. With 25 wafers per chamber, this tool is available in single or double-bowl configurations. The SRD can be configured to benchtop, stand-alone or bulkhead fab requirements. This tool features Spray - On-axis orientation allows cold or hot (>50ºC) water to evenly spray the wafers. Clean/Rinse - Built-in resistivity monitoring assures an automatic and reliable clean: the process chamber is cleaned with the product: quick-ramp, brushless DC motor provides economy and efficiency. Centrifugal drying, coupled with heated, filtered nitrogen and a low-pressure nitrogen purge with blanket heaters Efficient Chamber Design. Easy to change rotors for simple reconfiguration to match any array of applications. A typical 25-wafer payload takes <7 minutes for a complete cycle (load, rinse, spin dry, unload) Ultra Clean - On-axis orientation keeps wafers parallel, allowing fresh DI water manifolds to spray both sides of the product uniformly Efficient - Up to ten user-defined recipes Low CoO - Smallest footprint with the highest throughput available with over 95% uptime Supports Spray Clean (SRD) Spin-Rinse-DrySpray Clean (SRD) Spin-Rinse-Dry






SRD-880S

Equinox is a single wafer, multi-chamber process platform for cassette-to-cassette cleaning, etching, developing, and electroplating. It offers configurations from one to six chambers with a centralized controller and robotics. The platform is capable of performing various processes on substrates ranging from 3" to 200mm in size. It works by using a central dual end-effector robot to transfer substrates from cassette to chamber and back again. Equinox can help automate manual steps and transfers while increasing throughput with a small footprint. It offers ultra-clean dry-to-dry operation with uniform plating and etching results. The platform can integrate sequential process steps with a low cost of ownership (CoO) and provides a migration path from small R&D platforms to production systems with the same process chambers and control features.

EQUINOX

The Spin Rinser/Dryer (SRD) is a tool that provides a high-speed rinse and dry of wafers. It is designed to achieve low particle counts and reduced DI water consumption, making it an efficient and effective tool for wafer processing. The SRD is 300mm ready, meaning it can accommodate wafers of that size. It also has the option for rinse dry or dry only, allowing for flexibility in its use.

The Storm Series offers advanced centrifugal spray cleaning solutions, ideal for carriers, boxes, and specifically the 300mm Front Opening Unified Pods (FOUPs) and Front Opening Shipping Boxes (FOSBs). Comprising the high-capacity Storm II and the economical Storm III, these cleaners are adept at handling cassette or carrier sizes up to 200mm. Notably, the Storm300 efficiently cleans and dries eight 300mm FOUPs and their doors in under 30 minutes, and can process up to 30 cassettes or FOUPs/FOSBs within an hour. Some of its standout advantages include its cost-effectiveness, making it the world's most economical cassette/box washer, and its high productivity. The Storm's notable features include its ability to rotate products through a DI water spray with an optional surfactant, ensuring thorough cleaning; a centrifugal acceleration drying system complemented by ULPA filtered and heated air; and a user-friendly dual color touch screen interface. Made from electropolished stainless steel, the Storm also boasts an anti-static system, a brushless DC motor drive, and the option for through-the-wall installation, ensuring both efficiency and durability.

STORM III

EQ222SR

The Semitool PSC-101 is a Spin Rinse Dryer Controller

PSC 101

ST-270

Storm II is an auxiliary system that is the industry’s first batch centrifugal spray cleaning tool for boxes and cassettes. It is unsurpassed by competing technology in terms of cleanliness, ease of use, and economy. The tool can batch clean spray 300mm Capsil and Crystalpak, clean 200mm boxes and cassettes, 95mm three-piece shippers, and 65mm carriers and shippers. With its advanced technology, Storm II provides a reliable and efficient solution for cleaning various types of containers. 

STORM II

SST 742

SRD-480S

This high performance tool cleans, rinses and dries product as large as 300mm round or 300mm square. With 25 wafers per chamber, this tool is available in single or double-bowl configurations. Introduced in 1979, over 25,000 units have shipped worldwide. The SRD can be configured to benchtop, stand-alone or bulkhead fab requirements. FEATURES Spray - On-axis orientation allows cold or hot (>50ºC) water to evenly spray the wafers Clean/Rinse - Built-in resistivity monitoring assures an automatic and reliable clean: the process chamber is cleaned with the product: quick-ramp, brushless DC motor provides economy and efficiency Dry - Centrifugal drying, coupled with heated, filtered nitrogen and a low-pressure nitrogen purge with blanket heaters Efficient Chamber Design Flexible - Easy to change rotors for simple reconfiguration to match any array of applications Fast - A typical 25-wafer payload takes <7 minutes for a complete cycle (load, rinse, spin dry, unload) Ultra Clean - On-axis orientation keeps wafers parallel, allowing fresh DI water manifolds to spray both sides of the product uniformly Efficient - Up to ten user-defined recipes Low CoO - Smallest footprint with the highest throughput available with over 95% uptime RELATED PROCESSES AND TECHNOLOGIES PROCESSES SUPPORTED Spray Clean (SRD) Spin-Rinse-DrySpray Clean (SRD) Spin-Rinse-Dry

SRD-8300S

ST 270D

System designed to strip photoresist with water soluble

WSST-608-AG

C225

Introduced to the market during fiscal 2002, the Sirius was designed specifically to deliver HydrOzone process. HydrOzone, using a minimal amount of deionized water and ozone is a low cost process option in comparison to the typical processes used for photoresist stripping, photolithography rework and organic cleans. The Sirius is a manually loaded semi-automated system with a 50 wafer capacity spray processing chamber. The system is available to accommodate either 200mm or 300mm wafer sizes.


6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

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