说明
无说明配置
Key Applications - PCB, IC Substrate, HDI, mSAP/SAP Inspection Target - Inner Layer/ Outer Layer/ Build-up / Chip Carrier Minimum Line / Space - 10 um (0.4 mil Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610mm (30"× 24") Panel Thickness - 25~7,500 um (1~300 mil) Weight - 900 kg Equipment Dimensions (W x D x H) - 1,610 × 1,780 × 1,860 mmOEM 型号描述
Ultra Fusion 300 delivers leading-edge AOI performance for advanced IC substrate production down to 10μm. Featuring powerful Multi-Image Technology, the system achieves the highest level of detection accuracy and operational efficiency required for successful production of today's complex applications.文件
无文件
类别
AOI
上次验证： 10 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
152851
晶圆尺寸：
未知
年份：
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / ORBOTECH
ULTRA FUSION 300
类别
AOI
上次验证： 10 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
152851
晶圆尺寸：
未知
年份：
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Key Applications - PCB, IC Substrate, HDI, mSAP/SAP Inspection Target - Inner Layer/ Outer Layer/ Build-up / Chip Carrier Minimum Line / Space - 10 um (0.4 mil Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610mm (30"× 24") Panel Thickness - 25~7,500 um (1~300 mil) Weight - 900 kg Equipment Dimensions (W x D x H) - 1,610 × 1,780 × 1,860 mmOEM 型号描述
Ultra Fusion 300 delivers leading-edge AOI performance for advanced IC substrate production down to 10μm. Featuring powerful Multi-Image Technology, the system achieves the highest level of detection accuracy and operational efficiency required for successful production of today's complex applications.文件
无文件