说明
Rework target L/S 10um or above; maximum copper foil thickness <70um; PCB MAX 660×610 mm; laser type YAG LASER, wavelength 532 nm, high-energy shaping, near-vertical irradiation, processing spot diameter 3 µm. Function Description: Uses laser irradiation to remove short circuits and residual copper on advanced HDI and IC substrates, including CSP, FC-CSP, BGA, and FC-BGA applications. Even for high-density substrate circuit designs, Ultra PerFix 120 can complete precise rework within 1 minute. When analysis reaches 10 µm, scrap can be minimized as much as possible.配置
无配置OEM 型号描述
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.文件
无文件
类别
AOI
上次验证： 3 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
58896
晶圆尺寸：
未知
年份：
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / ORBOTECH
ULTRA PERFIX 120
类别
AOI
上次验证： 3 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
58896
晶圆尺寸：
未知
年份：
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Rework target L/S 10um or above; maximum copper foil thickness <70um; PCB MAX 660×610 mm; laser type YAG LASER, wavelength 532 nm, high-energy shaping, near-vertical irradiation, processing spot diameter 3 µm. Function Description: Uses laser irradiation to remove short circuits and residual copper on advanced HDI and IC substrates, including CSP, FC-CSP, BGA, and FC-BGA applications. Even for high-density substrate circuit designs, Ultra PerFix 120 can complete precise rework within 1 minute. When analysis reaches 10 µm, scrap can be minimized as much as possible.配置
无配置OEM 型号描述
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.文件
无文件