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说明
无说明配置
无配置OEM 型号描述
‘Xceed MICRO’ is a precise and high speed 2D & 3D AOI machine. It is optimized for inspections required in PCB, lead-frame, FC, and SiP assembly process such as die attach, cu clip attach, underfill, solder paste and ball attach. ‘Xceed MICRO’ delivers precise 2D inspection capability and at the same time it performs high speed 3D inspections (Height, Tilt, Lift, and Volume) with its highly focused laser beam. Additionally, ‘Xceed MICRO’ is the only machine capable of inspecting foreign material/contamination and warpage on the die surface, metal lead frame, and PCB substrates simultaneously.文件
无文件
类别
AOI
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
97677
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PARMI
XCEED MICRO
类别
AOI
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
97677
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
‘Xceed MICRO’ is a precise and high speed 2D & 3D AOI machine. It is optimized for inspections required in PCB, lead-frame, FC, and SiP assembly process such as die attach, cu clip attach, underfill, solder paste and ball attach. ‘Xceed MICRO’ delivers precise 2D inspection capability and at the same time it performs high speed 3D inspections (Height, Tilt, Lift, and Volume) with its highly focused laser beam. Additionally, ‘Xceed MICRO’ is the only machine capable of inspecting foreign material/contamination and warpage on the die surface, metal lead frame, and PCB substrates simultaneously.文件
无文件