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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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EVG805

概述

The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.

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