说明
Semi-automatic Thermal Slide De-Bonder Thermal slide-off debonding Bottom IR lamp heating Chuck sizes: 8 inch Suitable for temporary bonded wafer stacks Recipe-controlled process Real-time process monitoring/logging (force, temperature, and position) 8 inch end effector available配置
无配置OEM 型号描述
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.文件
无文件
类别
Bonder/Debonder
上次验证： 20 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
144932
晶圆尺寸：
8"/200mm
年份：
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG805
类别
Bonder/Debonder
上次验证： 20 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
144932
晶圆尺寸：
8"/200mm
年份：
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Semi-automatic Thermal Slide De-Bonder Thermal slide-off debonding Bottom IR lamp heating Chuck sizes: 8 inch Suitable for temporary bonded wafer stacks Recipe-controlled process Real-time process monitoring/logging (force, temperature, and position) 8 inch end effector available配置
无配置OEM 型号描述
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.文件
无文件