说明
Thermal Slide De-Bonder配置
无配置OEM 型号描述
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.文件
无文件
类别
Bonder/Debonder
上次验证： 9 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
144932
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG805
类别
Bonder/Debonder
上次验证： 9 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
144932
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Thermal Slide De-Bonder配置
无配置OEM 型号描述
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.文件
无文件