说明
无说明配置
Modules: -Carrier Station Block (CSB): -Carrier station block Robotic Arm (CRA) -Gang Air Bonding Block (GAB): -Gang Air Bonding Press Module (GANG) -Gang Air Robotic Arm (GARA) -Notch Alignment Module (NAM) -Transition Stage (TRS) -Slim Chill Plate Process Station War page Wafer Leveling (SCPW) -Breaker electrical Box -FOUP Type Loading Gang bonder comes as 3 modules: -CSB (Main body) -GAB (Main body) -Booster pump (External utility)OEM 型号描述
未提供文件
无文件
TEL / TOKYO ELECTRON
SYNAPSE
已验证
类别
Bonder/Debonder
上次验证： 13 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
44844
晶圆尺寸：
12"/300mm
年份：
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
SYNAPSE
类别
Bonder/Debonder
上次验证： 13 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
44844
晶圆尺寸：
12"/300mm
年份：
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Modules: -Carrier Station Block (CSB): -Carrier station block Robotic Arm (CRA) -Gang Air Bonding Block (GAB): -Gang Air Bonding Press Module (GANG) -Gang Air Robotic Arm (GARA) -Notch Alignment Module (NAM) -Transition Stage (TRS) -Slim Chill Plate Process Station War page Wafer Leveling (SCPW) -Breaker electrical Box -FOUP Type Loading Gang bonder comes as 3 modules: -CSB (Main body) -GAB (Main body) -Booster pump (External utility)OEM 型号描述
未提供文件
无文件