说明
无说明配置
Not Working / RefurbishedOEM 型号描述
The key characteristic of the power semiconductor packaging market is its need for continuous technological progress. Shrinking package sizes, cost reduction, switching power enhancements and the integration of intelligent control circuits in smart power packages are the most crucial aspects.文件
无文件
BESI / ESEC
2007 SSI
已验证
类别
Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
70841
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / ESEC
2007 SSI
类别
Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
70841
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Not Working / RefurbishedOEM 型号描述
The key characteristic of the power semiconductor packaging market is its need for continuous technological progress. Shrinking package sizes, cost reduction, switching power enhancements and the integration of intelligent control circuits in smart power packages are the most crucial aspects.文件
无文件