说明
无说明配置
无配置OEM 型号描述
A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.文件
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EVGroup (EVG)
GEMINI
已验证
类别
Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
Deinstalled
产品编号：
102684
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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EVGroup (EVG)
GEMINI
类别
Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
Deinstalled
产品编号：
102684
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.文件
无文件