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EVGroup (EVG) EVG850
    说明
    De-Bonder
    配置
    无配置
    OEM 型号描述
    Automated production bonding system for a wide range of fusion/molecular wafer bonding applications SOI wafers are a promising new basic material for the microelectronics industry to produce faster and higher-performance microelectronic devices. Wafer bonding, as one key enabling technology for the SOI wafer fabrication process, achieves high-quality single-crystal silicon films on insulating substrates. With the EVG850 SOI production bonding system, all essential steps for SOI bonding – from cleaning and alignment to pre-bonding and IR-inspection – are combined. Thus, the EVG850 assures a high-yield production process for void-free SOI wafers up to 300 mm sizes. Being the only production system built to operate in high-throughput, high-yield environments, the EVG850 has been established as the industry standard in the SOI wafer market.
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    EVGroup (EVG)

    EVG850

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    已验证

    类别
    Bonders

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    41193


    晶圆尺寸:

    8"/200mm


    年份:

    2001

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    类似上架物品
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    EVGroup (EVG) EVG850

    EVGroup (EVG)

    EVG850

    Bonders
    年份: 2001状况: 二手
    上次验证60 多天前

    EVGroup (EVG)

    EVG850

    verified-listing-icon
    已验证
    类别
    Bonders
    上次验证: 60 多天前
    listing-photo-04254f54e6d14104ae7c9ce1ced44c6d-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    41193


    晶圆尺寸:

    8"/200mm


    年份:

    2001


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    De-Bonder
    配置
    无配置
    OEM 型号描述
    Automated production bonding system for a wide range of fusion/molecular wafer bonding applications SOI wafers are a promising new basic material for the microelectronics industry to produce faster and higher-performance microelectronic devices. Wafer bonding, as one key enabling technology for the SOI wafer fabrication process, achieves high-quality single-crystal silicon films on insulating substrates. With the EVG850 SOI production bonding system, all essential steps for SOI bonding – from cleaning and alignment to pre-bonding and IR-inspection – are combined. Thus, the EVG850 assures a high-yield production process for void-free SOI wafers up to 300 mm sizes. Being the only production system built to operate in high-throughput, high-yield environments, the EVG850 has been established as the industry standard in the SOI wafer market.
    文件

    无文件

    类似上架物品
    查看全部
    EVGroup (EVG) EVG850

    EVGroup (EVG)

    EVG850

    Bonders年份: 2001状况: 二手上次验证: 60 多天前
    EVGroup (EVG) EVG850

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    Bonders年份: 2012状况: 二手上次验证: 60 多天前
    EVGroup (EVG) EVG850

    EVGroup (EVG)

    EVG850

    Bonders年份: 0状况: 二手上次验证: 60 多天前