说明
无说明配置
无配置OEM 型号描述
The EVG®510 is a semi-automated wafer bonding system that is versatile and quick to adapt. It can accommodate various substrate sizes, ranging from pieces to 200 mm. It is compatible with all standard wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct. Its design allows for swift retooling for different wafer sizes and processes, with a conversion time of less than 5 minutes.文件
无文件
EVGroup (EVG)
EVG510
已验证
类别
Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
102964
晶圆尺寸：
12"/300mm
年份：
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG510
类别
Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
102964
晶圆尺寸：
12"/300mm
年份：
2023
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The EVG®510 is a semi-automated wafer bonding system that is versatile and quick to adapt. It can accommodate various substrate sizes, ranging from pieces to 200 mm. It is compatible with all standard wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct. Its design allows for swift retooling for different wafer sizes and processes, with a conversion time of less than 5 minutes.文件
无文件