说明
Wafer bonding system配置
SOI and direct wafer bondingOEM 型号描述
The EVG®850XT (frequently referred to as the EVG850 XT configuration) is an industry-grade, fully automated universal temporary bonding and debonding platform manufactured by EV Group (EVG).文件
无文件
类别
Bonders
上次验证： 2 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
154221
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG850 XT
类别
Bonders
上次验证： 2 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
154221
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer bonding system配置
SOI and direct wafer bondingOEM 型号描述
The EVG®850XT (frequently referred to as the EVG850 XT configuration) is an industry-grade, fully automated universal temporary bonding and debonding platform manufactured by EV Group (EVG).文件
无文件