说明
无说明配置
无配置OEM 型号描述
High accuracy die bonder with the 2-in-1 concept, which supports a stacked die packaging with DAF process and general-purpose products of paste process. It can be switched easily between direct mode and parallel mode, which enables flexible production that supports the optimal process. Productivity Use of intermediate stage ensures high quality and high productivity Multilayering support • Improved accuracy of bonding placement • Integrated vision system with position correction • Clean operation support reduces particle contamination during multilayering Thin die bonding technology • Multi-stage pickup enables thin die pickup operation • Wide variety of bonding sequences helps to reduce die stresses文件
无文件
FASFORD
DB830plus+
已验证
类别
Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
87221
晶圆尺寸：
未知
年份：
2022
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
FASFORD
DB830plus+
类别
Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
87221
晶圆尺寸：
未知
年份：
2022
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
High accuracy die bonder with the 2-in-1 concept, which supports a stacked die packaging with DAF process and general-purpose products of paste process. It can be switched easily between direct mode and parallel mode, which enables flexible production that supports the optimal process. Productivity Use of intermediate stage ensures high quality and high productivity Multilayering support • Improved accuracy of bonding placement • Integrated vision system with position correction • Clean operation support reduces particle contamination during multilayering Thin die bonding technology • Multi-stage pickup enables thin die pickup operation • Wide variety of bonding sequences helps to reduce die stresses文件
无文件