说明

The completely revised table top die bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility of the table top die bonder to protect your investment in the face of ever-changing challenges. Due to the table top flip chip bonder’s ergonomic machine design and software-supported user guidance, the user remains at the center of action. Powerful optical systems allow the user to keep an overview at all times, even when working in the sub-micron range. The table top die bonder FINEPLACER® lambda shares a common module range and innovative operating software with Finetech's automatic die bonding systems to ensure a seamless process migration to series production. Features:  Sub-micron placement accuracy  Superior optical resolution  Excellent price performance ratio  Individual configurations with process modules  Numerous bonding technologies (adhesive, soldering)  Data/media logging and reporting function  Wide range of controlled bonding forces  Full process access & easy visual programming with touch screen interface  Various bonding technologies in one recipe  Process module compatibility across Finetech platforms  In-situ process observation in HD  Modular machine platform allows in-field retrofitting during entire service life  Synchronized control of all process related parameters Overlay vision alignment system (VAS) with fixed beam splitter  Sequence control with predefined parameters

配置

Upgrade Option:-  Fineplacer-96 Lambda Base Module  Fineplacer-96 Lambda Flip Control Module  Fineplacer-96 Lambda Pick Up Module  Heating Plate & Heating Plate-2  Loctite & UV Wand Curing System  Epoxy Dispenser Module  Wafer Holder Ring  Anti-Vibration Isolated Table  Accessories