说明
无说明配置
无配置OEM 型号描述
The SPA-300 Super is a high-speed epoxy die bonder that is compatible with stacked die and thin die. It is also compatible with 150-300mm wafers and is designed for bonding Lead Frame, Singulated BGA, and Flex Tape. . It has an ultra-thin wafer/die handling mechanism that supports the latest thin packages. The digitization of each setting enables flexible multi-model support. A magazine loader stocker model is also available. The SPA-300 Super has a high-rigidity casting integrated structure body that achieves excellent damping. It also has a friendly operation by adopting GUI. Various optional functions support ultra-thin die bonding and stacked package production. The SPA-300 Super has achieved higher throughput by improving the machine cycle. It is equipped with a post-bonding inspection function to enable bonding quality control. The SPA-300 Super is compatible with 0.35mm minimum dies, contributing to the production of MCM and SiP (option).文件
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SHINKAWA
SPA 300 SUPER
已验证
类别
Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79203
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SHINKAWA
SPA 300 SUPER
类别
Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79203
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The SPA-300 Super is a high-speed epoxy die bonder that is compatible with stacked die and thin die. It is also compatible with 150-300mm wafers and is designed for bonding Lead Frame, Singulated BGA, and Flex Tape. . It has an ultra-thin wafer/die handling mechanism that supports the latest thin packages. The digitization of each setting enables flexible multi-model support. A magazine loader stocker model is also available. The SPA-300 Super has a high-rigidity casting integrated structure body that achieves excellent damping. It also has a friendly operation by adopting GUI. Various optional functions support ultra-thin die bonding and stacked package production. The SPA-300 Super has achieved higher throughput by improving the machine cycle. It is equipped with a post-bonding inspection function to enable bonding quality control. The SPA-300 Super is compatible with 0.35mm minimum dies, contributing to the production of MCM and SiP (option).文件
无文件