说明
无说明配置
-Bonding method: Ultrasonic thermocompression - Bonding speed: 67 ms/2mm wire (with loop control). Depends on device conditions - Bonding wire length: Max 8 mm - Pattern recognition unit: - Detection method: Gray scale correlation - Detection speed: 0.11 s max. / 2-point alignment (including move time) - Bonding area: X: 28mm / Y: 33mm - Number of bonding wires: Max 8000 wires - Applicable lead frame dims: - Width: 20 ~ 80 mm - Length: 95 ~ 262 mm - Thickness: 0.07 ~ 0.3 mm - Loader / unloader: Magazine stacker type - Indexer: Center-parting type universal indexer - Power supply: AC 100 V 5 % 50/60 Hz - Power consumption: Approx. 1000 W - Compressed air: 500 kPa{5 kgf / cm2} 60 I/min - Vacuum pressure: -74 kPa{-550 mmHg} or less (Gauge pressure)OEM 型号描述
未提供文件
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SHINKAWA
UTC 1000
已验证
类别
Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
47099
晶圆尺寸：
未知
年份：
2006
Have Additional Questions?
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Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SHINKAWA
UTC 1000
类别
Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
47099
晶圆尺寸：
未知
年份：
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
-Bonding method: Ultrasonic thermocompression - Bonding speed: 67 ms/2mm wire (with loop control). Depends on device conditions - Bonding wire length: Max 8 mm - Pattern recognition unit: - Detection method: Gray scale correlation - Detection speed: 0.11 s max. / 2-point alignment (including move time) - Bonding area: X: 28mm / Y: 33mm - Number of bonding wires: Max 8000 wires - Applicable lead frame dims: - Width: 20 ~ 80 mm - Length: 95 ~ 262 mm - Thickness: 0.07 ~ 0.3 mm - Loader / unloader: Magazine stacker type - Indexer: Center-parting type universal indexer - Power supply: AC 100 V 5 % 50/60 Hz - Power consumption: Approx. 1000 W - Compressed air: 500 kPa{5 kgf / cm2} 60 I/min - Vacuum pressure: -74 kPa{-550 mmHg} or less (Gauge pressure)OEM 型号描述
未提供文件
无文件