说明
Applications: This system bonds a product substrate and product chips with high-pressure air and high-temperature heart for IC development and manufacturing. This system is generally called a permanent bonder.配置
- System Configuration: This system consist of wafer processing equipment and a peripheral device (air booster) that supplies high-pressure air. - Equipment Configuration: The equipment consist of two types of blocks: Carrier Station Block (CSB) and Gang Air Bonding Block (GAB).OEM 型号描述
未提供文件
无文件
TEL / TOKYO ELECTRON
SYNAPSE
已验证
类别
Bonders
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
44844
晶圆尺寸：
12"/300mm
年份：
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
SYNAPSE
已验证
类别
Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
44844
晶圆尺寸：
12"/300mm
年份：
2015
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Applications: This system bonds a product substrate and product chips with high-pressure air and high-temperature heart for IC development and manufacturing. This system is generally called a permanent bonder.配置
- System Configuration: This system consist of wafer processing equipment and a peripheral device (air booster) that supplies high-pressure air. - Equipment Configuration: The equipment consist of two types of blocks: Carrier Station Block (CSB) and Gang Air Bonding Block (GAB).OEM 型号描述
未提供文件
无文件