说明
无说明配置
无配置OEM 型号描述
The Applied Reflexion GT platform, the industry's only available 300mm dual-wafer CMP product delivers the highest throughput density at the lowest cost per wafer. Serving copper and tungsten applications, the platform is extendible to other applications and future technology nodes. Complementing dedicated slurry delivery and pad conditioning for each wafer, the Reflexion GT system's advanced head and process controls, including in-platen metrology, allow for precise control of final thickness, ensuring benchmark uniformity within wafer and wafer to wafer. This is akin to having a mower that can cut every blade of grass on an American football field to the same length within the width of a human hair. For post-polish cleaning, a five-module dual cleaner (with an optional sixth module) features Applied Materials' production-proven Desica cleaning and rinsing technology with Marangoni vapor drying for fast, effective, watermark-free drying.文件
无文件
APPLIED MATERIALS (AMAT)
REFLEXION GT
已验证
类别
CMP
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
96410
晶圆尺寸：
未知
年份：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
REFLEXION GT
类别
CMP
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
96410
晶圆尺寸：
未知
年份：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The Applied Reflexion GT platform, the industry's only available 300mm dual-wafer CMP product delivers the highest throughput density at the lowest cost per wafer. Serving copper and tungsten applications, the platform is extendible to other applications and future technology nodes. Complementing dedicated slurry delivery and pad conditioning for each wafer, the Reflexion GT system's advanced head and process controls, including in-platen metrology, allow for precise control of final thickness, ensuring benchmark uniformity within wafer and wafer to wafer. This is akin to having a mower that can cut every blade of grass on an American football field to the same length within the width of a human hair. For post-polish cleaning, a five-module dual cleaner (with an optional sixth module) features Applied Materials' production-proven Desica cleaning and rinsing technology with Marangoni vapor drying for fast, effective, watermark-free drying.文件
无文件