说明
Package Grinder配置
无配置OEM 型号描述
2011 Developed the ultra high precision DFS8960 surface planer which supports 300 mm wafers. Fully-automatic surface planer for Φ300 mm wafers Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.文件
无文件
DISCO
DFS8960
已验证
类别
CMP
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
111735
晶圆尺寸：
未知
年份：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFS8960
类别
CMP
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
111735
晶圆尺寸：
未知
年份：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Package Grinder配置
无配置OEM 型号描述
2011 Developed the ultra high precision DFS8960 surface planer which supports 300 mm wafers. Fully-automatic surface planer for Φ300 mm wafers Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals, resins, and their composites as well as solutions for reducing bump height variation and surface roughness.文件
无文件