说明
wet cleaning of debonded thin wafer on tape-frame / carrier wafer配置
无配置OEM 型号描述
SUSS MicroTec’s semi-automated wet-processing system SD12 offers superior cleaning and lift-off functions for solvent media applications. The single-wafer processing platform serves pieces, wafer sizes up to 300 mm, square substrates up to 230 x 230 mm and tape frames for wafers up to 300 mm. Its ability to handle various media and processes gives the flexibility needed for switching between applications and makes the tool first choice for research environment and small scale production.文件
无文件
SUSS MicroTec / KARL SUSS
SD12
已验证
类别
Coaters & Developers
上次验证： 26 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
103670
晶圆尺寸：
未知
年份：
2022
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
SD12
类别
Coaters & Developers
上次验证： 26 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
103670
晶圆尺寸：
未知
年份：
2022
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
wet cleaning of debonded thin wafer on tape-frame / carrier wafer配置
无配置OEM 型号描述
SUSS MicroTec’s semi-automated wet-processing system SD12 offers superior cleaning and lift-off functions for solvent media applications. The single-wafer processing platform serves pieces, wafer sizes up to 300 mm, square substrates up to 230 x 230 mm and tape frames for wafers up to 300 mm. Its ability to handle various media and processes gives the flexibility needed for switching between applications and makes the tool first choice for research environment and small scale production.文件
无文件