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RITE TRACK / ASML / SVG 88
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The 88 series uses an enhanced in-line robotic transfer arm between each module which makes critical transfers, such as between soft bake and chill, much more easily controlled compared to a totally random robotic system. The 88 Series is ideal for submicron manufacturing and is capable of processing 3″ through 150 mm substrates including Silicon, GaAs, Sapphire, GGG, Lithium Niobate, thin film heads, MEMS and many other substrate types.
    文件

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    类别
    Coaters & Developers

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    82814


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    RITE TRACK / ASML / SVG

    88

    verified-listing-icon
    已验证
    类别
    Coaters & Developers
    上次验证: 60 多天前
    listing-photo-a6ebf178ad2b485a98a2e9bc3ea91674-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/46251/a6ebf178ad2b485a98a2e9bc3ea91674/5b4d5fda68c94bb4a242d1c85ba19499_80baea7e1ac74277867a52fafd6104801201a_mw.jpeg
    listing-photo-a6ebf178ad2b485a98a2e9bc3ea91674-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/46251/a6ebf178ad2b485a98a2e9bc3ea91674/01de50f1281e460dbef892281d6419d2_690a33cfb5f242c79b5837ee0f8b8ebb_mw.jpeg
    listing-photo-a6ebf178ad2b485a98a2e9bc3ea91674-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/46251/a6ebf178ad2b485a98a2e9bc3ea91674/188e20965f5b41899d6e45b94a0a1f5c_a1ea925241ca46b48bf4af87211160071201a_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    82814


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The 88 series uses an enhanced in-line robotic transfer arm between each module which makes critical transfers, such as between soft bake and chill, much more easily controlled compared to a totally random robotic system. The 88 Series is ideal for submicron manufacturing and is capable of processing 3″ through 150 mm substrates including Silicon, GaAs, Sapphire, GGG, Lithium Niobate, thin film heads, MEMS and many other substrate types.
    文件

    无文件