说明
HDP CVD (Chemical Vapor Deposition)配置
无配置OEM 型号描述
Centura Ultima HDP 200mm and 300mm systems deliver a high-density plasma CVD process. It has been the industry-leading workhorse delivering high-quality dielectric films and void-free gapfill. Its reactor enables customers to achieve the productivity, cost-efficiency, and extendibility needed for multi-generation manufacturing. The Ultima HDP system features dual RF coils for superior gap-fill capability across the wafer; its innovative electrostatic chuck enables excellent film quality and uniformity; combined with remote plasma clean, it delivers exceptional defect and mean-wafer-between-clean performance. The product’s advanced technology enables deposition of both undoped and doped films for a wide range of applications, including STI, PMD, ILD, IMD, and passivation. Its versatility further extends to etchback and high-density plasma treatment for improved film quality.文件
无文件
类别
CVD
上次验证： 8 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
147499
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA ULTIMA TE
类别
CVD
上次验证： 8 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
147499
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
HDP CVD (Chemical Vapor Deposition)配置
无配置OEM 型号描述
Centura Ultima HDP 200mm and 300mm systems deliver a high-density plasma CVD process. It has been the industry-leading workhorse delivering high-quality dielectric films and void-free gapfill. Its reactor enables customers to achieve the productivity, cost-efficiency, and extendibility needed for multi-generation manufacturing. The Ultima HDP system features dual RF coils for superior gap-fill capability across the wafer; its innovative electrostatic chuck enables excellent film quality and uniformity; combined with remote plasma clean, it delivers exceptional defect and mean-wafer-between-clean performance. The product’s advanced technology enables deposition of both undoped and doped films for a wide range of applications, including STI, PMD, ILD, IMD, and passivation. Its versatility further extends to etchback and high-density plasma treatment for improved film quality.文件
无文件