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APPLIED MATERIALS (AMAT) P5000 CVD
    说明
    2 Teos DLH
    配置
    2C/H
    OEM 型号描述
    The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.
    文件

    无文件

    类别
    CVD

    上次验证: 11 天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    76120


    晶圆尺寸:

    8"/200mm


    年份:

    2000


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    APPLIED MATERIALS (AMAT)

    P5000 CVD

    verified-listing-icon
    已验证
    类别
    CVD
    上次验证: 11 天前
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    listing-photo-9e203e39eec6434e911a21273e1a6c7c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2205/9e203e39eec6434e911a21273e1a6c7c/addd2bffe79a477d97af14ffd8ce0a18_2_mw.jpg
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    listing-photo-9e203e39eec6434e911a21273e1a6c7c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2205/9e203e39eec6434e911a21273e1a6c7c/b3e8c77305944f168e1aa7129dee398a_8_mw.jpg
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    listing-photo-9e203e39eec6434e911a21273e1a6c7c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2205/9e203e39eec6434e911a21273e1a6c7c/69db13932d174d09a3b0d5d1b46940ef_10_mw.jpg
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    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    76120


    晶圆尺寸:

    8"/200mm


    年份:

    2000


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    2 Teos DLH
    配置
    2C/H
    OEM 型号描述
    The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.
    文件

    无文件

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    查看全部