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LAM RESEARCH / NOVELLUS CONCEPT TWO "C2" DUAL SEQUEL
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2" DUAL SEQUEL
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2" DUAL SEQUEL
  • LAM RESEARCH / NOVELLUS CONCEPT TWO "C2" DUAL SEQUEL
说明
无说明
配置
无配置
OEM 型号描述
The NOVELLUS CONCEPT TWO DUAL SEQUEL is a system that uses reactive ion-beam deposition to deposit thick films onto wafers. It has two process chambers that can provide the throughput power of twelve stations, resulting in dramatic improvements in productivity for these types of films. It is designed for high throughput deposition of thick films, such as layers before CMP (chemical-mechanical planarization), and dual layer passivation films. It also offers dual-beam operation for increased wafer-to-wafer uniformity and higher deposition rates, as well as process control capabilities and versatile materials handling for a wide range of applications.
文件

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PREFERRED
 
SELLER
类别
CVD

上次验证: 60 多天前

Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

114141


晶圆尺寸:

未知


年份:

未知


Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

LAM RESEARCH / NOVELLUS

CONCEPT TWO "C2" DUAL SEQUEL

verified-listing-icon
已验证
类别
CVD
上次验证: 60 多天前
listing-photo-b47c3b459fc849b6b06cede7122e7793-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

114141


晶圆尺寸:

未知


年份:

未知


Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明
配置
无配置
OEM 型号描述
The NOVELLUS CONCEPT TWO DUAL SEQUEL is a system that uses reactive ion-beam deposition to deposit thick films onto wafers. It has two process chambers that can provide the throughput power of twelve stations, resulting in dramatic improvements in productivity for these types of films. It is designed for high throughput deposition of thick films, such as layers before CMP (chemical-mechanical planarization), and dual layer passivation films. It also offers dual-beam operation for increased wafer-to-wafer uniformity and higher deposition rates, as well as process control capabilities and versatile materials handling for a wide range of applications.
文件

无文件