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说明
无说明配置
LePECVDOEM 型号描述
VERSALINE system models are configured to perform an array of etch and deposition processes. Ion beam technology suits a range of applications, from low, controllable damage etching to high-rate, high-aspect-ratio, deep silicon etching to difficult materials. The systems support process control through EndpointWorks®. Enhancements include data logging, automated maintenance scheduler (AMS), and SECS/GEM. Our Cortex® control system provides a stable, user-friendly control interface designed for efficiency and productivity. The VERSALINE platform’s modular design allows for flexible configuration of substrate handling for a variety of handling options, from R&D single wafer or carrier loading with a loadlock to high-volume, multi-chamber production clusters. Clear upgrade paths that leverage costs and process development make future planning easy.文件
无文件
类别
CVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
66905
晶圆尺寸：
6"/150mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PLASMATHERM
VERSALINE CVD
类别
CVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
66905
晶圆尺寸：
6"/150mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
LePECVDOEM 型号描述
VERSALINE system models are configured to perform an array of etch and deposition processes. Ion beam technology suits a range of applications, from low, controllable damage etching to high-rate, high-aspect-ratio, deep silicon etching to difficult materials. The systems support process control through EndpointWorks®. Enhancements include data logging, automated maintenance scheduler (AMS), and SECS/GEM. Our Cortex® control system provides a stable, user-friendly control interface designed for efficiency and productivity. The VERSALINE platform’s modular design allows for flexible configuration of substrate handling for a variety of handling options, from R&D single wafer or carrier loading with a loadlock to high-volume, multi-chamber production clusters. Clear upgrade paths that leverage costs and process development make future planning easy.文件
无文件