说明
System has always been under full service contract and is in very good conditioning. Uvision SP 200 is a BF (Bright Field) wafer inspection tool It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe配置
Uvision SP 200 is a BF (Bright Field) wafer inspection tool 200/300 mm capebiliity It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe,OEM 型号描述
未提供文件
无文件
类别
Defect Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Running
产品编号：
113572
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
UVISION 200
类别
Defect Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Running
产品编号：
113572
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
System has always been under full service contract and is in very good conditioning. Uvision SP 200 is a BF (Bright Field) wafer inspection tool It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe配置
Uvision SP 200 is a BF (Bright Field) wafer inspection tool 200/300 mm capebiliity It is designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers Ligth source: Laser ( ג= 266 nm) Tool scans a wafer in a meander path Die to Die ” and Cell to Cell ” comparison capability Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection On pattern wafers capable of detecting defects of 25 nm with 90 % Capture Rate (Data from D&E recipe,OEM 型号描述
未提供文件
无文件