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APPLIED MATERIALS (AMAT) UVISION 5
    说明
    无说明
    配置
    details attached.
    OEM 型号描述
    The Applied UVision 5 wafer inspection system detects yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices. Applied also offers the Applied DFinder system, the first darkfield wafer inspection system to use DUV laser scanning to detect particles as small as 40nm in interconnect layers. The UVision® 5 system isa member of the UVision wafer inspection product family, supporting the same proprietary core technology of deep ultraviolet (DUV) laser illumination, with simultaneous dual channel [brightfield (BF) reflected light and grayfield (GF) scattered light] collection optics. The system exhibits new defect inspection capabilities on advanced patterning layers in both FEOL and BEOL applications for 2xnm production and beyond, addressing such technologies as ArF immersion lithography, double and quad patterning, and extreme ultraviolet layers. The UVision 5 system’s dramatically increased light density enables detection of 1xnm killer defects - some never captured before - resulting in a twofold improvement in killer defect capture rates. This, in turn, results in a more accurate and comprehensive defect Pareto that significantly improves statistical process control in the wafer fab. The platform’s unique GF detection architecture now captures more light to enable detection of defects in the range of 1xnm (approximately the width of up to five DNA strands). New imaging modes improve detection sensitivity to further increase UVision technology leadership in GF scanning. Novel image processing algorithms reduce wafer noise by up to 50% in various types of memory structures, contributing to a higher capture rate, especially on BEOL layers.
    文件

    APPLIED MATERIALS (AMAT)

    UVISION 5

    verified-listing-icon

    已验证

    类别
    Defect Inspection

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    68079


    晶圆尺寸:

    12"/300mm


    年份:

    2011


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect Inspection
    年份: 2011状况: 二手
    上次验证60 多天前

    APPLIED MATERIALS (AMAT)

    UVISION 5

    verified-listing-icon
    已验证
    类别
    Defect Inspection
    上次验证: 60 多天前
    listing-photo-9d4ecdf096c345508f7ddb0a4a062f95-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1877/9d4ecdf096c345508f7ddb0a4a062f95/1586048b1c644bf4ac127f53fba9cc3b_a4e8ff7b434e44ebb28dc29ba16b314e1201a_mw.jpeg
    listing-photo-9d4ecdf096c345508f7ddb0a4a062f95-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1877/9d4ecdf096c345508f7ddb0a4a062f95/5850047fc2be4e0ba93b80999bfee92b_d40707f3eaad4d30986d1ccd43c01a581201a_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    68079


    晶圆尺寸:

    12"/300mm


    年份:

    2011


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    details attached.
    OEM 型号描述
    The Applied UVision 5 wafer inspection system detects yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices. Applied also offers the Applied DFinder system, the first darkfield wafer inspection system to use DUV laser scanning to detect particles as small as 40nm in interconnect layers. The UVision® 5 system isa member of the UVision wafer inspection product family, supporting the same proprietary core technology of deep ultraviolet (DUV) laser illumination, with simultaneous dual channel [brightfield (BF) reflected light and grayfield (GF) scattered light] collection optics. The system exhibits new defect inspection capabilities on advanced patterning layers in both FEOL and BEOL applications for 2xnm production and beyond, addressing such technologies as ArF immersion lithography, double and quad patterning, and extreme ultraviolet layers. The UVision 5 system’s dramatically increased light density enables detection of 1xnm killer defects - some never captured before - resulting in a twofold improvement in killer defect capture rates. This, in turn, results in a more accurate and comprehensive defect Pareto that significantly improves statistical process control in the wafer fab. The platform’s unique GF detection architecture now captures more light to enable detection of defects in the range of 1xnm (approximately the width of up to five DNA strands). New imaging modes improve detection sensitivity to further increase UVision technology leadership in GF scanning. Novel image processing algorithms reduce wafer noise by up to 50% in various types of memory structures, contributing to a higher capture rate, especially on BEOL layers.
    文件
    类似上架物品
    查看全部
    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect Inspection年份: 2011状况: 二手上次验证:60 多天前
    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect Inspection年份: 0状况: 二手上次验证:30 多天前
    APPLIED MATERIALS (AMAT) UVISION 5

    APPLIED MATERIALS (AMAT)

    UVISION 5

    Defect Inspection年份: 2011状况: 二手上次验证:60 多天前