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APPLIED MATERIALS (AMAT) UVISION 3
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    Applied UVision® 3 system, the industry’s highest productivity DUV1 Brightfield wafer inspection tool with the critical-defect detection sensitivity required for 45 nanometer (nm) FEOL2 and immersion lithography. Delivering significant advancements to Applied’s breakthrough UVision technology, this next-generation system triples the number of laser beams scanning the wafer to provide 40% faster throughput than any competitive system. Two new imaging modes extend sensitivity to 20nm, and a new flexible automatic defect classification engine enables quick access to defects of interest and faster yield learning. imaging modes in the illumination and collection path which address the contrast versatility required for periphery areas; innovative algorithms of high defect accuracy and stitch-to-stitch detection enable enhanced sensitivity on edge of array and on high-end devices; dual screen configuration with High Resolution Review, which minimizes SEM review time; and new automatic classification capabilities provide quick access to defect-of-interest to reduce yield learning cycle. Additionally, UVision 3’s proprietary ActiveScan technique dynamically compensates for process and color variations within and across wafers.
    文件

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    APPLIED MATERIALS (AMAT)

    UVISION 3

    verified-listing-icon

    已验证

    类别
    Defect Inspection

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    29600


    晶圆尺寸:

    未知


    年份:

    2008


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    APPLIED MATERIALS (AMAT) UVISION 3

    APPLIED MATERIALS (AMAT)

    UVISION 3

    Defect Inspection
    年份: 2008状况: 二手
    上次验证60 多天前

    APPLIED MATERIALS (AMAT)

    UVISION 3

    verified-listing-icon
    已验证
    类别
    Defect Inspection
    上次验证: 60 多天前
    listing-photo-9a869ad004b741fb831b9c90f40edc38-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1650/9a869ad004b741fb831b9c90f40edc38/fab17a979f3e4150bdbb7b2e92b7ed13_e0854bf525744efea37d18510564f2e11201a_mw.jpeg
    listing-photo-9a869ad004b741fb831b9c90f40edc38-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1650/9a869ad004b741fb831b9c90f40edc38/40e6486bc1bc41c9bc6899f68c82ae3b_f963d8d9f7804f8b8e3ae9832132e360_mw.png
    listing-photo-9a869ad004b741fb831b9c90f40edc38-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1650/9a869ad004b741fb831b9c90f40edc38/377d0ef24f6345b0881cdfc7b81ecf2a_fa702103fe3c46c69ee89d9fd7377512_mw.png
    listing-photo-9a869ad004b741fb831b9c90f40edc38-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1650/9a869ad004b741fb831b9c90f40edc38/50b00f6d770e4010b104990f8f309269_b31d9624ecb5402eac0965280dc148b6_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    29600


    晶圆尺寸:

    未知


    年份:

    2008


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    Applied UVision® 3 system, the industry’s highest productivity DUV1 Brightfield wafer inspection tool with the critical-defect detection sensitivity required for 45 nanometer (nm) FEOL2 and immersion lithography. Delivering significant advancements to Applied’s breakthrough UVision technology, this next-generation system triples the number of laser beams scanning the wafer to provide 40% faster throughput than any competitive system. Two new imaging modes extend sensitivity to 20nm, and a new flexible automatic defect classification engine enables quick access to defects of interest and faster yield learning. imaging modes in the illumination and collection path which address the contrast versatility required for periphery areas; innovative algorithms of high defect accuracy and stitch-to-stitch detection enable enhanced sensitivity on edge of array and on high-end devices; dual screen configuration with High Resolution Review, which minimizes SEM review time; and new automatic classification capabilities provide quick access to defect-of-interest to reduce yield learning cycle. Additionally, UVision 3’s proprietary ActiveScan technique dynamically compensates for process and color variations within and across wafers.
    文件

    无文件

    类似上架物品
    查看全部
    APPLIED MATERIALS (AMAT) UVISION 3

    APPLIED MATERIALS (AMAT)

    UVISION 3

    Defect Inspection年份: 2008状况: 二手上次验证:60 多天前