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说明
Defect_Inspection(BF)配置
无配置OEM 型号描述
Wafer inspection. Core technology of DUV laser illumination and full polarization control, with simultaneous dual channel (brightfield reflected light and grayfield scattered light) collection optics unique to this product line sub-10nm defect sensitivity. It also enhances defect inspection on advanced patterning layers in FEOL and BEOL applications for the 1xnm node, addressing technologies that include logic, DRAM, 3D NAND, double and quadruple patterning, and EUV layers. n addition, the UVision 8 system incorporates Marker 2, the next generation of an integrated CAD-based application that combines customer regions-of-interest information and wafer characteristics based on customer needs. This capability enhances sensitivity while also boosting capture rates of prioritized defects of interest, enabling region-of-interest based binning, and tightening coordinate accuracy文件
无文件
类别
Defect Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
120677
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
UVISION 8
类别
Defect Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
120677
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Defect_Inspection(BF)配置
无配置OEM 型号描述
Wafer inspection. Core technology of DUV laser illumination and full polarization control, with simultaneous dual channel (brightfield reflected light and grayfield scattered light) collection optics unique to this product line sub-10nm defect sensitivity. It also enhances defect inspection on advanced patterning layers in FEOL and BEOL applications for the 1xnm node, addressing technologies that include logic, DRAM, 3D NAND, double and quadruple patterning, and EUV layers. n addition, the UVision 8 system incorporates Marker 2, the next generation of an integrated CAD-based application that combines customer regions-of-interest information and wafer characteristics based on customer needs. This capability enhances sensitivity while also boosting capture rates of prioritized defects of interest, enabling region-of-interest based binning, and tightening coordinate accuracy文件
无文件