说明
无说明配置
QZ_DefectOEM 型号描述
high resolution tool down to 3nm that performs hot spot inspection for both logic and memory fabs as a customers' process node goes into volume production. eP3 for 3nm is seeing demand from memory fabs' 25nm to 20nm migration.文件
无文件
类别
Defect Inspection
上次验证： 13 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
144870
晶圆尺寸：
12"/300mm
年份：
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASML / HMI
eP3
类别
Defect Inspection
上次验证： 13 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
144870
晶圆尺寸：
12"/300mm
年份：
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
QZ_DefectOEM 型号描述
high resolution tool down to 3nm that performs hot spot inspection for both logic and memory fabs as a customers' process node goes into volume production. eP3 for 3nm is seeing demand from memory fabs' 25nm to 20nm migration.文件
无文件