说明
无说明配置
无配置OEM 型号描述
high resolution tool down to 3nm that performs hot spot inspection for both logic and memory fabs as a customers' process node goes into volume production. eP3 for 3nm is seeing demand from memory fabs' 25nm to 20nm migration.文件
无文件
类别
Defect Inspection
上次验证： 昨天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
158857
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASML / HMI
eP3
类别
Defect Inspection
上次验证： 昨天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
158857
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
high resolution tool down to 3nm that performs hot spot inspection for both logic and memory fabs as a customers' process node goes into volume production. eP3 for 3nm is seeing demand from memory fabs' 25nm to 20nm migration.文件
无文件