概述

The AIT II is a patterned wafer inspection system for 150 to 300 mm wafers that provides fast, accurate feedback on process tool performance. It offers an integrated solution for automated defect classification and analysis, quickly turning defect data into yield-enhancing information. It is designed for flexibility in films, etch, photo, and CMP applications and offers advantages such as reducing process excursions, increasing overall equipment effectiveness, improving yield stability/predictability, and augmenting line monitoring.