说明
Dark Field. Software version 5.3.17, single open cassette handler. SECS II/GEM communication interface, include RTC option, 75MW 488nm Argon Laser, Multi Channel collection optics system with independent programmable spatial filters 10um single incident spot optics, additional 7um and 5 um spot size, flat panel display (AIT 2), Fold down keyboard tray with built-in mouse.配置
无配置OEM 型号描述
The AIT II is a patterned wafer inspection system for 150 to 300 mm wafers that provides fast, accurate feedback on process tool performance. It offers an integrated solution for automated defect classification and analysis, quickly turning defect data into yield-enhancing information. It is designed for flexibility in films, etch, photo, and CMP applications and offers advantages such as reducing process excursions, increasing overall equipment effectiveness, improving yield stability/predictability, and augmenting line monitoring.文件
无文件
KLA
AIT II
已验证
类别
Defect Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
24647
晶圆尺寸：
8"/200mm
年份：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA
AIT II
类别
Defect Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
24647
晶圆尺寸：
8"/200mm
年份：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Dark Field. Software version 5.3.17, single open cassette handler. SECS II/GEM communication interface, include RTC option, 75MW 488nm Argon Laser, Multi Channel collection optics system with independent programmable spatial filters 10um single incident spot optics, additional 7um and 5 um spot size, flat panel display (AIT 2), Fold down keyboard tray with built-in mouse.配置
无配置OEM 型号描述
The AIT II is a patterned wafer inspection system for 150 to 300 mm wafers that provides fast, accurate feedback on process tool performance. It offers an integrated solution for automated defect classification and analysis, quickly turning defect data into yield-enhancing information. It is designed for flexibility in films, etch, photo, and CMP applications and offers advantages such as reducing process excursions, increasing overall equipment effectiveness, improving yield stability/predictability, and augmenting line monitoring.文件
无文件