跳至主要内容
Moov logo

Moov Icon
KLA AIT UV
    说明
    Darkfield inspection
    配置
    无配置
    OEM 型号描述
    AIT UV™ is a high-throughput, high-sensitivity wafer inspection product that uses Dual AOD technology to increase scan rate, UV laser illumination for increased sensitivity, and advanced detection algorithms for improved defect capture. It also features real-time Adaptive Mode™ technology, three-channel double-darkfield optics, MultiSpot™ illumination, and Inline Automatic Defect Classification (iADC) for faster results. It is part of KLA-Tencor’s AIT family of inspection systems and is designed for 300-mm inspection and excursion monitoring at 100-nm design rules and below.
    文件

    无文件

    verified-listing-icon

    已验证

    类别
    Defect Inspection

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    112936


    晶圆尺寸:

    12"/300mm


    年份:

    2005


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    KLA

    AIT UV

    verified-listing-icon
    已验证
    类别
    Defect Inspection
    上次验证: 60 多天前
    listing-photo-1833110bc4a541eeb5b517df641be72b-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    112936


    晶圆尺寸:

    12"/300mm


    年份:

    2005


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Darkfield inspection
    配置
    无配置
    OEM 型号描述
    AIT UV™ is a high-throughput, high-sensitivity wafer inspection product that uses Dual AOD technology to increase scan rate, UV laser illumination for increased sensitivity, and advanced detection algorithms for improved defect capture. It also features real-time Adaptive Mode™ technology, three-channel double-darkfield optics, MultiSpot™ illumination, and Inline Automatic Defect Classification (iADC) for faster results. It is part of KLA-Tencor’s AIT family of inspection systems and is designed for 300-mm inspection and excursion monitoring at 100-nm design rules and below.
    文件

    无文件