Details attached.

EFEM Wafer Handler Not Included

KLA-Tencor AIT Fusion XUV Darkfield Inspection System.pdf

KLA inhabits two worlds: one that’s nanometers in scale and one that’s global. This micro and macro view gives us a unique perspective. We see electrons wave and industries transform. When you put deep science together with optimism, big things happen.

Our process-control and process-enabling solutions are designed to boost the innovation speed of the electronics industry. We help our customers achieve leading-edge performance.

The AIT XUV is KLA-Tencor’s next-generation double-darkfield optical inspection tool. It offers higher throughput and sensitivity for 65-nm production requirements, with a wide range of spot sizes and advanced detection algorithms. It also features an auto-positioning system, autofocus unit, and iADC capability for faster results. It is field upgradeable from the AIT UV platform and provides detection capability for current-layer defects at speeds up to three times faster than the prior-generation AIT XP system, with improved focus, tracking performance, and die-to-die registration.

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AIT XUV

Defect Inspection

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Defect Inspection

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