
说明
Wafer Size: 2 ~ 8 inch available (Currently 6" configured) Application S/W: 7.0 Build 11 OS Version: Windows XP professional SP3 Cassette Handling: Standard single puck with up to 200 mm cassette handler capability Illumination Source: Circumferential (50 mW, 405 nm), Radial (85 mW, 660 nm) Performance • Substrate Thickness: 380 ~ 1,300 µm • Defect Sensitivity: 0.08 µm (PSL on bare) Application Defect inspection of both opaque substrates such as Si, GaAs, and InP, as well as transparent materials such as SiC, GaN, sapphire, and glass. Utility • Physical Dimension (WDH): 110 * 138 * 180 cm • Weight Instrument: 860 lb (391 kg) • Input Power: 115 V 12 A 50/60 Hz • CDA: 95 ~ 110 PSI配置
无配置OEM 型号描述
The Candela 8620 is an automated defect inspection system for LED substrates and epitaxy wafers. It provides enhanced quality control for materials such as gallium nitride, sapphire, and silicon carbide. Its proprietary optical design and detection technology can detect sub-micron defects that are not consistently identified by current inspection methods. This enables a production line monitor for yield-limiting defects, improving MOCVD reactor uptime and yield. The system can detect defects such as micro-scratches, micro-cracks, missing bumps, resist voids, hexagonal pits, and epi cracks, which can impact device performance, yield, and reliability.文件
类别
Defect Inspection
上次验证: 今天
物品主要详细信息
状况:
Refurbished
运行状况:
未知
产品编号:
138243
晶圆尺寸:
2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm
年份:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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CANDELA 8620
类别
Defect Inspection
上次验证: 今天
物品主要详细信息
状况:
Refurbished
运行状况:
未知
产品编号:
138243
晶圆尺寸:
2"/50mm, 3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm
年份:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available