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KLA SURFSCAN SP2
  • KLA SURFSCAN SP2
  • KLA SURFSCAN SP2
说明
working condition, but no HDD
配置
无配置
OEM 型号描述
The Surfscan SP2 is an unpatterned wafer surface inspection tool that uses UV laser technology, darkfield optics, and advanced algorithms to detect defects as small as 30nm. It provides high sensitivity detection on engineered substrates and has a significant throughput increase over the prior-generation tool. It offers a single tool solution for three technology nodes and has comprehensive wafer surface inspection capabilities. It also enables faster root-cause analysis with improved coordinate accuracy and real-time defect classification capability.
文件
PREFERRED
 
SELLER
类别
Defect Inspection

上次验证: 60 多天前

Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

84587


晶圆尺寸:

12"/300mm


年份:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

KLA

SURFSCAN SP2

verified-listing-icon
已验证
类别
Defect Inspection
上次验证: 60 多天前
listing-photo-24ed875185a74fa4ad79d730384cee6b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/54780/24ed875185a74fa4ad79d730384cee6b/08a7ced9fabe4b808fbbdac163392d04_33d2f293e7d242b98632efe5db2247521201a_mw.jpeg
listing-photo-24ed875185a74fa4ad79d730384cee6b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/54780/24ed875185a74fa4ad79d730384cee6b/62642a34a92240a1ba533071d9749eb9_941ccf33b25644c2a075368e69c4bb64_mw.jpeg
Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

84587


晶圆尺寸:

12"/300mm


年份:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
working condition, but no HDD
配置
无配置
OEM 型号描述
The Surfscan SP2 is an unpatterned wafer surface inspection tool that uses UV laser technology, darkfield optics, and advanced algorithms to detect defects as small as 30nm. It provides high sensitivity detection on engineered substrates and has a significant throughput increase over the prior-generation tool. It offers a single tool solution for three technology nodes and has comprehensive wafer surface inspection capabilities. It also enables faster root-cause analysis with improved coordinate accuracy and real-time defect classification capability.
文件