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ONTO / RUDOLPH / AUGUST AXi-940
    说明
    Rudolph Technologies / Onto Innovation automatic inline wafer inspection tool AXi 940 b Model: AXi940b Operating hours lamp: <8.000h Year of manufacture: 07/2010 Technical data: AXi-940b: 200-240V AC 50/60Hz 6A WHS220: 208-240V AC 50/60Hz max. 20A 110psi Features: o Loading connections for 6 and 8 inch wafers o Handler, robot and prealigner internal o Lenses 1x 2x 5x 10x 20x o Internal barcode reader o Inspection camera b/w o Colour review camera o Frontsite and clustersite computer (WIN7) o Software Version 3.9.4.18 Accessories: Documentation General information about the system: The Rudolph AXi940 is an automated macro inspection system specifically designed for front side inspection of semiconductor wafers. The system was introduced by Rudolph Technologies (now part of Onto Innovation) and is part of the ‘Explorer Inspection Cluster’ - a modular platform for inspecting multiple wafer surfaces. Inspection area: The AXi940 is designed for macroscopic inspection of the wafer front surface and is primarily used to detect macro defects. Software: The system features a modernised user interface designed to reduce operating costs through increased productivity, higher system reliability and minimised operator interaction. Automation: Integrated, intelligent software supports the automatic creation of inspection recipes. This significantly reduces the time required and the need for manual intervention by the operator. System integration: The AXi940 can be fully integrated into the Explorer Inspection Cluster as a module. It can be operated offline for recipe creation while parallel production processes in other modules continue undisturbed. Installation dimensions: approx. 2x1.5x2m Commissioning: Commissioning of the system can be organised by the manufacturer through us and carried out on your premises for an additional charge. Simply ask us about this. Maintenance: The system was last serviced in 2024. Professional maintenance of the system can optionally be carried out by the manufacturer. This service is subject to a charge and can be ordered and organised through us.
    配置
    无配置
    OEM 型号描述
    The AXi™ 940 is a frontside inspection module that is designed to reduce cost of ownership by improving defect detectability across multiple front-end applications. It delivers higher resolution than traditional macro systems while maintaining high throughput required in today’s advanced high-volume processes. The AXi 940 addresses customer demand for both productivity and capability by eliminating the small lot penalty and providing numerous automated capabilities, including advanced proprietary defect detection algorithms, real-time binning to on defects of interest, multiple resolution capability, five-minute recipe creation, and three simultaneous defect review methods: on-the-fly, high resolution, whole wafer. The AXi 940 can also team with edge and backside modules for an all-surface solution. Overall, the AXi 940 is a powerful tool for automated, 100% advanced macro defect inspection.
    文件

    无文件

    类别
    Defect Inspection

    上次验证: 30 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    Installed / Running


    产品编号:

    127547


    晶圆尺寸:

    6"/150mm, 8"/200mm


    HDD / Software:
    Yes

    年份:

    2010


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    ONTO / RUDOLPH / AUGUST

    AXi-940

    verified-listing-icon
    已验证
    类别
    Defect Inspection
    上次验证: 30 多天前
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    物品主要详细信息

    状况:

    Used


    运行状况:

    Installed / Running


    产品编号:

    127547


    晶圆尺寸:

    6"/150mm, 8"/200mm


    HDD / Software:
    Yes

    年份:

    2010


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Rudolph Technologies / Onto Innovation automatic inline wafer inspection tool AXi 940 b Model: AXi940b Operating hours lamp: <8.000h Year of manufacture: 07/2010 Technical data: AXi-940b: 200-240V AC 50/60Hz 6A WHS220: 208-240V AC 50/60Hz max. 20A 110psi Features: o Loading connections for 6 and 8 inch wafers o Handler, robot and prealigner internal o Lenses 1x 2x 5x 10x 20x o Internal barcode reader o Inspection camera b/w o Colour review camera o Frontsite and clustersite computer (WIN7) o Software Version 3.9.4.18 Accessories: Documentation General information about the system: The Rudolph AXi940 is an automated macro inspection system specifically designed for front side inspection of semiconductor wafers. The system was introduced by Rudolph Technologies (now part of Onto Innovation) and is part of the ‘Explorer Inspection Cluster’ - a modular platform for inspecting multiple wafer surfaces. Inspection area: The AXi940 is designed for macroscopic inspection of the wafer front surface and is primarily used to detect macro defects. Software: The system features a modernised user interface designed to reduce operating costs through increased productivity, higher system reliability and minimised operator interaction. Automation: Integrated, intelligent software supports the automatic creation of inspection recipes. This significantly reduces the time required and the need for manual intervention by the operator. System integration: The AXi940 can be fully integrated into the Explorer Inspection Cluster as a module. It can be operated offline for recipe creation while parallel production processes in other modules continue undisturbed. Installation dimensions: approx. 2x1.5x2m Commissioning: Commissioning of the system can be organised by the manufacturer through us and carried out on your premises for an additional charge. Simply ask us about this. Maintenance: The system was last serviced in 2024. Professional maintenance of the system can optionally be carried out by the manufacturer. This service is subject to a charge and can be ordered and organised through us.
    配置
    无配置
    OEM 型号描述
    The AXi™ 940 is a frontside inspection module that is designed to reduce cost of ownership by improving defect detectability across multiple front-end applications. It delivers higher resolution than traditional macro systems while maintaining high throughput required in today’s advanced high-volume processes. The AXi 940 addresses customer demand for both productivity and capability by eliminating the small lot penalty and providing numerous automated capabilities, including advanced proprietary defect detection algorithms, real-time binning to on defects of interest, multiple resolution capability, five-minute recipe creation, and three simultaneous defect review methods: on-the-fly, high resolution, whole wafer. The AXi 940 can also team with edge and backside modules for an all-surface solution. Overall, the AXi 940 is a powerful tool for automated, 100% advanced macro defect inspection.
    文件

    无文件