说明
-Includes WHS (wafer handling station) -Installed and running配置
无配置OEM 型号描述
The NSX-100 is a high-throughput and repeatable macro defect inspection solution that is part of the NSX® Series. It is designed to detect macro defects (defects 0.5 micron and larger) that can occur during various stages of device manufacturing, such as wafer manufacturing, probing, bumping, dicing, or general handling. These defects can have a significant impact on the quality of microelectronic devices. The NSX-100 provides fast and consistent 2D bump inspection and valuable process information for enhanced process control and product consistency. This information can be transferred to Discover™, Rudolph’s yield management software, for further analysis and review. The NSX-100 is suitable for 200 mm applications and has time-tested applications in various markets, including semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS), and micro display markets. It offers automated, 100% advanced macro defect inspection to ensure quality assurance. NSX-100 series systems are able to inspect as many as 97 wafers-per-hour.文件
无文件
类别
Defect Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
130985
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / RUDOLPH / AUGUST
NSX-100
类别
Defect Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
130985
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
-Includes WHS (wafer handling station) -Installed and running配置
无配置OEM 型号描述
The NSX-100 is a high-throughput and repeatable macro defect inspection solution that is part of the NSX® Series. It is designed to detect macro defects (defects 0.5 micron and larger) that can occur during various stages of device manufacturing, such as wafer manufacturing, probing, bumping, dicing, or general handling. These defects can have a significant impact on the quality of microelectronic devices. The NSX-100 provides fast and consistent 2D bump inspection and valuable process information for enhanced process control and product consistency. This information can be transferred to Discover™, Rudolph’s yield management software, for further analysis and review. The NSX-100 is suitable for 200 mm applications and has time-tested applications in various markets, including semiconductor, optoelectronics, wafer bumping, data storage, micro electromechanical systems (MEMS), and micro display markets. It offers automated, 100% advanced macro defect inspection to ensure quality assurance. NSX-100 series systems are able to inspect as many as 97 wafers-per-hour.文件
无文件