说明
DP-2D/3D METROLOGY & INSPECTION TOOL配置
无配置OEM 型号描述
The NSX 330 System is an advanced packaging system that improves cost of ownership by enabling multiple applications in a single platform. It combines inspection and metrology to measure multiple applications, including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load. The system offers robust platform technology and is suitable for a wide range of applications. It also offers a choice of inspection platforms with hard-anodized finish which can accommodate 100mm to 330mm whole wafers and features programmable light tower, programmable illumination filter wheel, multiple modes of dark field illumination, standard docking module, resolution flexibility (10µm to 0.5µm), three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer. It teams with edge and backside modules for all-surface solution and offers unique handling solutions (Mems, Taiko, Thin), extreme warpage (>12mm) and ultra-thin (<50µm). The system also supports tool matching, recipe sharing, recipe server, Discover® Software database results archiving, offline inspection and metrology engineering clients as well as offline defect review clients.文件
无文件
ONTO / RUDOLPH / AUGUST
NSX-330
已验证
类别
Defect Inspection
上次验证： 22 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115332
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / RUDOLPH / AUGUST
NSX-330
类别
Defect Inspection
上次验证： 22 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115332
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
DP-2D/3D METROLOGY & INSPECTION TOOL配置
无配置OEM 型号描述
The NSX 330 System is an advanced packaging system that improves cost of ownership by enabling multiple applications in a single platform. It combines inspection and metrology to measure multiple applications, including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load. The system offers robust platform technology and is suitable for a wide range of applications. It also offers a choice of inspection platforms with hard-anodized finish which can accommodate 100mm to 330mm whole wafers and features programmable light tower, programmable illumination filter wheel, multiple modes of dark field illumination, standard docking module, resolution flexibility (10µm to 0.5µm), three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer. It teams with edge and backside modules for all-surface solution and offers unique handling solutions (Mems, Taiko, Thin), extreme warpage (>12mm) and ultra-thin (<50µm). The system also supports tool matching, recipe sharing, recipe server, Discover® Software database results archiving, offline inspection and metrology engineering clients as well as offline defect review clients.文件
无文件