说明
无说明配置
无配置OEM 型号描述
AutoWafer is an ultrasonic wafer scanner for nondestructive testing (NDT) of wafers in development and production environments, providing high-resolution identification of bond defects in wafer applications such as MEMS, CMOS, memory, TSV and LED. Robotic cassette handling and sorting of approved and failed wafers helps speed production, while our advanced transducers and auto-analysis tools make it quick and easy to identify even the smallest, most subtle defects. -The ideal automatic ultrasonic testing system for detecting wafer-to-wafer bonding defects -A fully automated, production-ready wafer scanner for MEMS, CMOS, BSI sensors, memory, TSV, LED and other applications employing wafers 200mm and smaller -Provides wafer map with die-level pass/fail indicators (optional) -Provides analysis (optional) -200mm SECS/GEM -TSV entrenched metrology文件
无文件
SONIX
AutoWafer
已验证
类别
Defect Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
72971
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SONIX
AutoWafer
类别
Defect Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
72971
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
AutoWafer is an ultrasonic wafer scanner for nondestructive testing (NDT) of wafers in development and production environments, providing high-resolution identification of bond defects in wafer applications such as MEMS, CMOS, memory, TSV and LED. Robotic cassette handling and sorting of approved and failed wafers helps speed production, while our advanced transducers and auto-analysis tools make it quick and easy to identify even the smallest, most subtle defects. -The ideal automatic ultrasonic testing system for detecting wafer-to-wafer bonding defects -A fully automated, production-ready wafer scanner for MEMS, CMOS, BSI sensors, memory, TSV, LED and other applications employing wafers 200mm and smaller -Provides wafer map with die-level pass/fail indicators (optional) -Provides analysis (optional) -200mm SECS/GEM -TSV entrenched metrology文件
无文件