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市场 > Deposition > APPLIED MATERIALS (AMAT) > CENTURA AP ISPRINT

CENTURA AP ISPRINT

概述

Employing a unique, “selective” suppression mechanism, the Centura® iSprint™ ALD/CVD SSW process delivers the industry’s first bottom-up CVD W gap fill, free of voids and seams. It optimizes the volume of W, creating more robust features and helping to improve yield.

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