CENTURA AP ISPRINT
概述
Employing a unique, “selective” suppression mechanism, the Centura® iSprint™ ALD/CVD SSW process delivers the industry’s first bottom-up CVD W gap fill, free of voids and seams. It optimizes the volume of W, creating more robust features and helping to improve yield.
活动的上架物品
3
服务
检验、保险、评估、物流