说明
VIA W配置
VIA WOEM 型号描述
Employing a unique, “selective” suppression mechanism, the Centura® iSprint™ ALD/CVD SSW process delivers the industry’s first bottom-up CVD W gap fill, free of voids and seams. It optimizes the volume of W, creating more robust features and helping to improve yield.文件
无文件
APPLIED MATERIALS (AMAT)
CENTURA AP ISPRINT
已验证
类别
Deposition
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
91266
晶圆尺寸：
12"/300mm
年份：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA AP ISPRINT
类别
Deposition
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
91266
晶圆尺寸：
12"/300mm
年份：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
VIA W配置
VIA WOEM 型号描述
Employing a unique, “selective” suppression mechanism, the Centura® iSprint™ ALD/CVD SSW process delivers the industry’s first bottom-up CVD W gap fill, free of voids and seams. It optimizes the volume of W, creating more robust features and helping to improve yield.文件
无文件